Термо паста Thermaltake TG-50 4G
Код на продукта:
78109
21.25 лв.
В наличност
Спецификации
Предназначен за
Охлаждащи системи
Характеристики
Х-ка 2
TG-50 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively.
Х-ка 3
With a thermal conductivity of 8.0 W/m-k, the thermal compound also contains diamonds powder allowing users to pursue a higher heat transfer rate.
Х-ка 4
Density: 2.9 g/cm3
Х-ка 5
Viscosity: 47 Pa-s
| Спецификации | |
| Предназначен за | Охлаждащи системи |
| Характеристики | |
| Х-ка 2 | TG-50 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively. |
| Х-ка 3 | With a thermal conductivity of 8.0 W/m-k, the thermal compound also contains diamonds powder allowing users to pursue a higher heat transfer rate. |
| Х-ка 4 | Density: 2.9 g/cm3 |
| Х-ка 5 | Viscosity: 47 Pa-s |
| Х-ка 6 | Thermal impedance: 0.035°C -in2/W |
| Х-ка 7 | Thermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs. |
| Х-ка 8 | This thermal compound application kit includes a set of easily-applied tools for immediate use. |
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